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Physical Dimensions
2X
0.8 MAX
2X
RECOMMENDED LAND PATTERN
0.05
0.00
SEATING
PLANE
A. CONFORMS TO JEDEC REGISTRATION MO-229,
VARIATION VEEC, DATED 11/2001
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCES PER
ASME Y14.5M, 1994
D. FILENAME: MKT-MLP08Drev2
Figure 57. 3x3 mm, 8-Lead Molded Leadless Package (MLP)
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/dwg/ML/MLP08D.pdf
? 2007 Fairchild Semiconductor Corporation
FAN3223 / FAN3224 / FAN3225 ? Rev. 1.1.4
25
www.fairchildsemi.com
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